HYTE Thermal Goop - High-Performance Thermal Paste (2g)

Description: Ensure your CPU stays cool under pressure with HYTE Thermal Goop. This premium thermal compound is engineered for enthusiasts and gamers who demand maximum heat transfer between their processor and cooler. With a high thermal conductivity rating, it fills the microscopic imperfections on the surfaces of your CPU and heatsink, eliminating air pockets that can trap heat.

Thermal Goop is designed for easy application, featuring an ideal consistency that spreads evenly without making a mess. It is non-conductive and non-capacitive, making it safe to use even for first-time builders. Whether you're air cooling or using a high-end AIO like the THICC Q60, this "goop" is the essential final touch for a stable, high-performance system.

Key Features

• High Thermal Conductivity: Optimized formula ensures rapid heat dissipation from the CPU to the cooler for lower operating temperatures.

• Easy Application: Comes in a convenient 2g syringe with a fine-tip nozzle for precise, mess-free dosing.

• Electrically Non-Conductive: Safe to apply; won't cause short circuits if it accidentally touches motherboard components or pins.

• Long-Term Stability: Resistant to drying out or "bleeding," maintaining its effectiveness for years without needing reapplication.

• Universal Compatibility: Works perfectly with all modern Intel and AMD CPUs, as well as high-performance GPUs.

Technical Specifications

• Weight: 2 Grams

• Color: Grey

• Thermal Conductivity: High

• Viscosity: Optimized for easy spreading

• Operating Temperature: -50°C to +200°C